一、綜合詞匯
1、印制電路:printed circuit
2、印制線路:printed wiring
3、印制板:printed board
4、印制板電路:printed circuit board(PCB)
5、印制線路板:printed wiring board(PWB)
6、印制組件:printed component
7、印制接點(diǎn):printed contact
8、印制板裝配:printed board assembly
9、板:board
10、單面印制板:single-sided printed board(SSB)
11、雙面印制板:double-sided printed board(DSB)
12、多層印制板:mulitlayer printed board(MLB)
13、多層印制電路板:mulitlayer printed circuit board
14、多層印制線路板:mulitlayer prited wiring board
15、剛性印制板:rigid printed board
16、剛性單面印制板:rigid single-sided printed borad
17、剛性雙面印制板:rigid double-sided printed borad
18、剛性多層印制板:rigid multilayer printed board
19、撓性多層印制板:flexible multilayer printed board
20、撓性印制板:flexible printed board
21、撓性單面印制板:flexible single-sided printed board
22、撓性雙面印制板:flexible double-sided printed board
23、撓性印制電路:flexible printed circuit(FPC)
24、撓性印制線路:flexible printed wiring
25、剛性印制板:flex-rigid printed board,rigid-flex printed board
26、剛性雙面印制板:flex-rigid double-sided printed board,rigid-flex double-sided printed
27、剛性多層印制板:flex-rigid multilayer printed board,rigid-flex multilayer printed board
28、齊平印制板:flush printed board
29、金屬芯印制板:metal core printed board
30、金屬基印制板:metal base printed board
31、多重布線印制板:mulit-wiring printed board
32、陶瓷印制板:ceramic substrate printed board
33、導(dǎo)電膠印制板:electroconductive paste printed board
34、模塑電路板:molded circuit board
35、模壓印制板:stamped printed wiring board
36、順序?qū)訅憾鄬佑≈瓢澹簊equentially-laminated mulitlayer
37、散線印制板:discrete wiring board
38、微線印制板:micro wire board
39、積層印制板:buile-up printed board
40、積層多層印制板:build-up mulitlayer printed board(BUM)
41、積層撓印制板:build-up flexible printed board
42、表面層合電路板:surface laminar circuit(SLC)
43、埋入凸塊連印制板:B2it printed board
44、多層膜基板:multi-layered film substrate(MFS)
45、層間全內(nèi)導(dǎo)通多層印制板:ALIVH multilayer printed board
46、載芯片板:chip on board(COB)
47、埋電阻板:buried resistance board
48、母板:mother board
49、子板:daughter board
50、背板:backplane
51、裸板:bare board
52、鍵盤板夾心板:copper-invar-copper board
53、動(dòng)態(tài)撓性板:dynamic flex board
54、靜態(tài)撓性板:static flex board
55、可斷拼板:break-away planel
56、電纜:cable
57、撓性扁平電纜:flexible flat cable(FFC)
58、薄膜開關(guān):membrane switch
59、混合電路:hybrid circuit
60、厚膜:thick film
61、厚膜電路:thick film circuit
62、薄膜:thin film
63、薄膜混合電路:thin film hybrid circuit
64、互連:interconnection
65、導(dǎo)線:conductor trace line
66、齊平導(dǎo)線:flush conductor
67、傳輸線:transmission line
68、跨交:crossover
69、板邊插頭:edge-board contact
70、增強(qiáng)板:stiffener
71、基底:substrate
72、基板面:real estate
73、導(dǎo)線面:conductor side
74、組件面:component side
75、焊接面:solder side
76、印制:printing
77、網(wǎng)格:grid
78、圖形:pattern
79、導(dǎo)電圖形:conductive pattern
80、非導(dǎo)電圖形:non-conductive pattern
81、字符:legend
82、標(biāo)志:mark
二、基材:
1、基材:base material
2、層壓板:laminate
3、覆金屬箔基材:metal-clad bade material
4、覆銅箔層壓板:copper-clad laminate(CCL)
5、單面覆銅箔層壓板:single-sided copper-clad laminate
6、雙面覆銅箔層壓板:double-sided copper-clad laminate
7、復(fù)合層壓板:composite laminate
8、薄層壓板:thin laminate
9、金屬芯覆銅箔層壓板:metal core copper-clad laminate
10、金屬基覆銅層壓板:metal base copper-clad laminate
11、撓性覆銅箔絕緣薄膜:flexible copper-clad dielectric film
12、基體材料:basis material
13、預(yù)浸材料:prepreg
14、粘結(jié)片:bonding sheet
15、預(yù)浸粘結(jié)片:preimpregnated bonding sheer
16、環(huán)氧玻璃基板:epoxy glass substrate
17、加成法用層壓板:laminate for additive process
18、預(yù)制內(nèi)層覆箔板:mass lamination panel
19、內(nèi)層芯板:core material
20、催化板材:catalyzed board,coated catalyzed laminate
21、涂膠催化層壓板:adhesive-coated catalyzed laminate
22、涂膠無催層壓板:adhesive-coated uncatalyzed laminate
23、粘結(jié)層:bonding layer
24、粘結(jié)膜:film adhesive
25、涂膠粘劑絕緣薄膜:adhesive coated dielectric film
26、無支撐膠粘劑膜:unsupported adhesive film
27、覆蓋層:cover layer(cover lay)
28、增強(qiáng)板材:stiffener material
29、銅箔面:copper-clad surface
30、去銅箔面:foil removal surface
31、層壓板面:unclad laminate surface
32、基膜面:base film surface
33、膠粘劑面:adhesive faec
34、原始光潔面:plate finish
35、粗面:matt finish
36、縱向:length wise direction
37、模向:cross wise direction
38、剪切板:cut to size panel
39、酚醛紙質(zhì)覆銅箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、環(huán)氧紙質(zhì)覆銅箔板:epoxide cellulose paper copper-clad laminates(epoxy/paper CCL)
41、環(huán)氧玻璃布基覆銅箔板:epoxide woven glass fabric copper-clad laminates
42、環(huán)氧玻璃布紙復(fù)合覆銅箔板:epoxide cellulose paper core,glass cloth surfaces copper-clad laminates
43、環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板:epoxide non woven/woven glass reinforced copper-clad laminates
44、聚酯玻璃布覆銅箔板:ployester woven glass fabric copper-clad laminates
45、聚酰亞胺玻璃布覆銅箔板:polyimide woven glass fabric copper-clad laminates
46、雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、環(huán)氧合成纖維布覆銅箔板:epoxide synthetic fiber fabric copper-clad laminates
48、聚四乙烯玻璃纖維覆銅箔板:teflon/fiber glass copper-clad laminates
49、超薄型層壓板:ultra thin laminate
50、陶瓷基覆銅箔板:ceramics base copper-clad laminates
51、紫外線阻擋型覆銅箔板:UV blocking copper-clad laminates
三、基材的材料
1、A階樹脂:A-stage resin
2、B階樹脂:B-stage resin
3、C階樹脂:C-stage resin
4、環(huán)氧樹脂:epoxy resin
5、酚醛樹脂:phenolic resin
6、聚酯樹脂:polyester resin
7、聚酰亞胺樹脂:polyimide resin
8、雙馬來酰亞胺三嗪樹脂:bismaleimide-triazine resin
9、丙烯酸樹脂:acrylic resin
10、三聚氰胺甲醛樹脂:melamine formaldehyde resin
11、多官能環(huán)氧樹脂:polyfunctional epoxy resin
12、溴化環(huán)氧樹脂:brominated epoxy resin
13、環(huán)氧酚醛:epoxy novolac
14、氟樹脂:fluroresin
15、硅樹脂:silicone resin
16、硅烷:silane
17、聚合物:polymer
18、無定形聚合物:amorphous polymer
19、結(jié)晶現(xiàn)象:crystalline polamer
20、雙晶現(xiàn)象:dimorphism
21、共聚物:copolymer
22、合成樹脂:synthetic
23、熱固性樹脂:thermosetting resin
24、熱塑性樹脂:thermoplastic resin
25、感旋光性樹脂:photosensitive resin
26、環(huán)氧當(dāng)量:weight per epoxy equivalent(WPE)
27、環(huán)氧值:epoxy value
28、雙氰胺:dicyandiamide
29、粘結(jié)劑:binder
30、膠粘劑:adesive
31、固化劑:curing agent
32、阻燃劑:flame retardant
33、遮光劑:opaquer
34、增塑劑:plasticizers
35、不飽和聚酯:unsatuiated polyester
36、聚酯薄膜:polyester
37、聚酰亞胺薄膜:polyimide film(PI)
38、聚四氟乙烯:polytetrafluoetylene(PTFE)
39、聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film(FEP)
40、增強(qiáng)材料:reinforcing material
41、玻璃纖維:glass fiber
42、E玻璃纖維:E-glass fibre
43、D玻璃纖維:D-glass fibre
44、S玻璃纖維:S-glass fibre
45、玻璃布:glass fabric
46、非織布:non-woven fabric
47、玻璃纖維墊:glass mats
48、紗線:yarn
49、單絲:filament
50、絞股:strand
51、緯紗:weft yarn
52、經(jīng)紗:warp yarn
53、但尼爾:denier
54、經(jīng)向:warp-wise
55、緯向:weft-wise,filling-wise
56、織物經(jīng)緯密度:thread count
57、織物組織:weave structure
58、平紋組織:plain structure
59、壞布:grey fabric
60、稀松織物:woven scrim
61、弓緯:bow of weave
62、斷經(jīng):end missing
63、缺緯:mis-picks
64、緯斜:bias
65、折痕:crease
66、云織:waviness
67、魚眼:fish eye
68、毛圈長:feather length
69、厚薄段:mark
70、裂縫:split
71、捻度:twist of yarn
72、浸潤劑含量:size content
73、浸潤劑殘留量:size residue
74、處理劑含量:finish level
75、浸潤劑:size
76、偶聯(lián)劑:couplint agent
77、處理織物:finished fabric
78、聚酰胺纖維:polyarmide fiber
79、聚酯纖維非織布:non-woven polyester fabric
80、浸漬絕緣縱紙:impregnating insulation paper
81、聚芳酰胺纖維紙:aromatic polyamide paper
82、斷裂長:breaking length
83、吸水高度:height of capillary rise
84、濕強(qiáng)度保留率:wet strength retention
85、白度:whitenness
86、陶瓷:ceramics
87、導(dǎo)電箔:conductive foil
88、銅箔:copper foil
89、電解銅箔:electrodeposited copper foil(ED copper foil)
90、壓延銅箔:rolled copper foil
91、退火銅箔:annealed copper foil
92、壓延退火銅箔:rolled annealed copper foil(RA copper foil)
93、薄銅箔:thin copper foil
94、涂膠銅箔:adhesive coated foil
95、涂膠脂銅箔:resin coated copper foil(RCC)
96、復(fù)合金屬箔:composite metallic material
97、載體箔:carrier foil
98、殷瓦:invar
99、箔(剖面)輪廓:foil profile
100、光面:shiny side
101、粗糙面:matte side
102、處理面:treated side
103、防銹處理:stain proofing
104、雙面處理銅箔:double treated foil
四、設(shè)計(jì)
1、原理圖:shematic diagram
2、邏輯圖:logic diagram
3、印制線路布設(shè):printed wire layout
4、布設(shè)總圖:master drawing
5、可制造性設(shè)計(jì):design-for-manufacturability
6、計(jì)算機(jī)輔助設(shè)計(jì):computer-aided design.(CAD)
7、計(jì)算機(jī)輔助制造:computer-aided manufacturing.(CAM)
8、計(jì)算機(jī)集成制造:computer integrat manufacturing.(CIM)
9、計(jì)算機(jī)輔助工程:computer-aided engineering.(CAE)
10、計(jì)算機(jī)輔助測試:computer-aided test.(CAT)
11、電子設(shè)計(jì)自動(dòng)化:electric design automation.(EDA)
12、工程設(shè)計(jì)自動(dòng)化:engineering design automaton.(EDA2)
13、組裝設(shè)計(jì)自動(dòng)化:assembly aided architectural design.(AAAD)
14、計(jì)算機(jī)輔助制圖:computer aided drawing
15、計(jì)算機(jī)控制顯示:computer controlled display.(CCD)
16、布局:placement
17、布線:routing
18、布圖設(shè)計(jì):layout
19、重布:rerouting
20、模擬:simulation
21、邏輯模擬:logic simulation
22、電路模擬:circit simulation
23、時(shí)序模擬:timing simulation
24、模塊化:modularization
25、布線完成率:layout effeciency
26、機(jī)器描述格式:machine descriptionm format.(MDF)
27、機(jī)器描述格式數(shù)據(jù)庫:MDF databse
28、設(shè)計(jì)數(shù)據(jù)庫:design database
29、設(shè)計(jì)原點(diǎn):design origin
30、優(yōu)化(設(shè)計(jì)):optimization(design)
31、供設(shè)計(jì)優(yōu)化坐標(biāo)軸:predominant axis
32、表格原點(diǎn):table origin
33、鏡像:mirroring
34、驅(qū)動(dòng)文件:drive file
35、中間文件:intermediate file
36、制造文件:manufacturing documentation
37、隊(duì)列支撐數(shù)據(jù)庫:queue support database
38、組件安置:component positioning
39、圖形顯示:graphics dispaly
40、比例因子:scaling factor
41、掃描填充:scan filling
42、矩形填充:rectangle filling
43、填充域:region filling
44、實(shí)體設(shè)計(jì):physical design
45、邏輯設(shè)計(jì):logic design
46、邏輯電路:logic circuit
47、層次設(shè)計(jì):hierarchical design
48、自頂向下設(shè)計(jì):top-down design
49、自底向上設(shè)計(jì):bottom-up design
50、線網(wǎng):net
51、數(shù)字化:digitzing
52、設(shè)計(jì)規(guī)則檢查:design rule checking
53、走(布)線器:router(CAD)
54、網(wǎng)絡(luò)表:net list
55、計(jì)算機(jī)輔助電路分析:computer-aided circuit analysis
56、子線網(wǎng):subnet
57、目標(biāo)函數(shù):objective function
58、設(shè)計(jì)后處理:post design processing(PDP)
59、交互式制圖設(shè)計(jì):interactive drawing design
60、費(fèi)用矩陣:cost metrix
61、工程圖:engineering drawing
62、方塊框圖:block diagram
63、迷宮:moze
64、組件密度:component density
65、巡回售貨員問題:traveling salesman problem
66、自由度:degrees freedom
67、入度:out going degree
68、出度:incoming degree
69、曼哈頓距離:manhatton distance
70、歐幾里德距離:euclidean distance
71、網(wǎng)絡(luò):network
72、陣列:array
73、段:segment
74、邏輯:logic
75、邏輯設(shè)計(jì)自動(dòng)化:logic design automation
76、分線:separated time
77、分層:separated layer
78、定順序:definite sequenc
五、形狀與尺寸:
1、導(dǎo)線(信道):conduction(track)
2、導(dǎo)線(體)寬度:conductor width
3、導(dǎo)線距離:conductor spacing
4、導(dǎo)線層:conductor layer
5、導(dǎo)線寬度/間距:conductor line/space
6、第一導(dǎo)線層:conductor layer No.1
7、圓形盤:round pad
8、方形盤:square pad
9、菱形盤:diamond pad
10、長方形焊盤:oblong pad
11、子彈形盤:bullet pad
12、淚滴盤:teardrop pad
13、雪人盤:snowman pad
14、V形盤:V-shaped pad
15、環(huán)形盤:annular pad
16、非圓形盤:non-circular pad
17、隔離盤:isolation pad
18、非功能連接盤:monfunctional pad
19、偏置連接盤:offset land
20、腹(背)裸盤:back-bard land
21、盤址:anchoring spaur
22、連接盤圖形:land pattern
23、連接盤網(wǎng)格陣列:land grid array
24、孔環(huán):annular ring
25、組件孔:component hole
26、安裝孔:mounting hole
27、支撐孔:supported hole
28、非支撐孔:unsupported hole
29、導(dǎo)通孔:via
30、鍍通孔:plated through hole(PTH)
31、余隙孔:access hole
32、盲孔:blind via(hole)
33、埋孔:buried via hole
34、埋/盲孔:buried/blind via
35、任意層內(nèi)部導(dǎo)通孔:any layer inner via hole(ALIVH)
36、全部鉆孔:all drilled hole
37、定位孔:toaling hole
38、無連接盤孔:landless hole
39、中間孔:interstitial hole
40、無連接盤導(dǎo)通孔:landless via hole
41、引導(dǎo)孔:pilot hole
42、端接全隙孔:terminal clearomee hole
43、準(zhǔn)表面間鍍覆孔:quasi-interfacing plated-through hole
44、準(zhǔn)尺寸孔:dimensioned hole
45、在連接盤中導(dǎo)通孔:via-in-pad
46、孔位:hole location
47、孔密度:hole density
48、孔圖:hole pattern
49、鉆孔圖:drill drawing
50、裝配圖:assembly drawing
51、印制板組裝圖:printed board assembly drawing
52、參考基準(zhǔn):datum referan
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